Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/181928
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of imparting a high surface quality and improving the polishing rate. Specifically provided is a polishing composition containing: silica particles that serve as abrasive grains; a basic compound; water; a cellulose derivative as a first water-soluble polymer; a polyvinyl alcohol-based polymer as a second water-soluble polymer; and a nitrogen atom-containing polymer as a third water-soluble polymer. In the polishing composition, the ratio (C1/(C2+C3)) of the content C1 of the first water-soluble polymer with respect to the total of the content C2 of the second water-soluble polymer and the content C3 of the third water-soluble polymer is 0.1 or greater.
Inventors:
GOTO OSAMU (JP)
TANAKA YUKI (JP)
TSUCHIYA KOHSUKE (JP)
TANAKA YUKI (JP)
TSUCHIYA KOHSUKE (JP)
Application Number:
PCT/JP2023/008722
Publication Date:
September 28, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; C08K3/36; C08L1/08; C08L29/04; C08L33/26; C09G1/02; C09K3/14
Foreign References:
| JP2021057467A | 2021-04-08 | |||
| JP2020161603A | 2020-10-01 | |||
| JP2020152890A | 2020-09-24 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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