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Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/181929
Kind Code:
A1
Abstract:
Provided is a polishing composition capable of imparting a high surface quality and improving the polishing rate. Specifically provided is a polishing composition containing: silica particles (A); a basic compound (B); a first water-soluble polymer (C1); a second water-soluble polymer (C2); and an alkali metal salt of an inorganic acid (D) (excluding alkali metal carbonates).

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Inventors:
GOTO OSAMU (JP)
TANAKA YUKI (JP)
Application Number:
PCT/JP2023/008723
Publication Date:
September 28, 2023
Filing Date:
March 08, 2023
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; C09G1/02; C09K3/14
Foreign References:
JP2020161603A2020-10-01
JP2021057467A2021-04-08
JP2004319759A2004-11-11
CN103740281A2014-04-23
US5860848A1999-01-19
Attorney, Agent or Firm:
ABE, Makoto (JP)
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