POLISHING DEVICE

WIPO Patent Application WO/2016/002537

A1

The present invention addresses the problem of providing a diamond polishing device in which a polishing member (3) having a long shape, such as a filamentous shape or a belt shape, is used, and polishing is performed while winding the polishing member (3) around a polishing-member support (4), continuously or intermittently displacing a polishing surface, and using the polishing-member support (4) to press the polishing surface against the surface of a member (1) to be polished, said diamond polishing device being provided with a function enabling the polishing of surfaces in semi-enclosed spaces such as the inner peripheral surfaces of cylindrical members and ring members. This polishing device is characterized by comprising: a polishing member (3) having a long shape; a means (6) which delivers and retrieves the polishing member (3); a polishing-member support (4) for holding the polishing member (3) such that the polishing member (3) is capable of being displaced by winding; a base (5) having the polishing-member support (4) attached thereto; and a pressing means (7) for pressing the base (5) towards a processing surface of a member (1) to be polished. The polishing device is further characterized in that: the base (5) is provided with an extended section (5a) extending in a direction different to the pressing direction; and the polishing-member support (4) is provided to the tip of the extended section (5a).

SHIROISHI RYOZO (JP)
TAKAO KENICHI (JP)
YAMAUCHI TAKAHIRO (JP)

PCT/JP2015/067681

January 07, 2016

June 19, 2015

Click for automatic bibliography generation  

TOYO SEIKAN GROUP HOLDINGS LTD (JP)

B24B21/00

JP2011177883A	2011-09-15
JPH09309056A	1997-12-02
JP2010538842A	2010-12-16
JPH08294860A	1996-11-12

See also references of EP 3165330A4

OSHIRO Shigenobu et al. (JP)
Oshiro Shigenobu (JP)

View/Download PDF      PDF Help

Previous Patent: PORTABLE ELECTRONIC TERMINAL HOLDER

Next Patent: TIRE