POLISHING DEVICE

WIPO Patent Application WO/2016/163063

A1

Disclosed is a polishing device that is provided with: a polishing head that transfers a wafer downward, while holding the wafer; and a polishing cloth that polishes a surface of the wafer transferred downward by means of the polishing head, said polishing cloth polishing the surface of the wafer by being in contact with the surface. The polishing device is characterized by being also provided with a position control unit, which is equipped with a cleaning unit that cleans the surface of the wafer transferred downward by means of the polishing head, said cleaning unit cleaning the surface of the wafer by being in contact with the surface, and which positions the polishing head above the polishing cloth by moving the polishing head or the polishing cloth or both the polishing head and the polishing cloth when polishing the wafer, and positions the polishing head above the cleaning unit by moving the polishing head or the cleaning unit or both the polishing head and the cleaning unit after polishing the wafer. Consequently, the polishing device capable of improving wafer surface cleaning effects after suppressing deterioration of wafer surface smoothness and deterioration of wafer productivity is provided.

UENO JUNICHI (JP)
SATO MICHITO (JP)
ISHII KAORU (JP)

PCT/JP2016/001072

October 13, 2016

February 29, 2016

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SHINETSU HANDOTAI KK (JP)

H01L21/304; B24B37/04; B24B55/06; H01L21/677

JP2002025956A	2002-01-25
JP2000317827A	2000-11-21
JP3143684U	2008-07-31
JPH10264011A	1998-10-06
JPH11277404A	1999-10-12

YOSHIMIYA, Mikio et al. (JP)
Good Miya Mikio (JP)

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