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Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233769
Kind Code:
A1
Abstract:
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing head (1).

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Inventors:
SUZUKI YUTA (JP)
TAKAHASHI TARO (JP)
WATANABE KATSUHIDE (JP)
TAKADA NOBUYUKI (JP)
Application Number:
PCT/JP2023/011153
Publication Date:
December 07, 2023
Filing Date:
March 22, 2023
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/30; B24B37/32; B24B41/06; B24B49/10; H01L21/304
Foreign References:
JP2020131329A2020-08-31
JP2022049249A2022-03-29
JP2019532825A2019-11-14
JP2005131732A2005-05-26
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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