Title:
POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING LIQUID
Document Type and Number:
WIPO Patent Application WO/2012/086781
Kind Code:
A1
Abstract:
Disclosed is a polishing liquid which contains cerium oxide particles, an organic acid A, a polymer compound B that has a carboxylic acid group or a carboxylate group, and water. The organic acid A has at least one group that is selected from the group consisting of a -COOM group, a -Ph-OM group, an -SO3M group and a -PO3M2 group, and the organic acid A has a pKa of less than 9. The organic acid A is contained in an amount of 0.001-1% by mass relative to the total mass of the polishing liquid, and the polymer compound B is contained in an amount of 0.01-0.50% by mass relative to the total mass of the polishing liquid. The polishing liquid has a pH of 4.0-7.0 (inclusive).
Inventors:
OOTA MUNEHIRO (JP)
TANAKA TAKAAKI (JP)
TAKIZAWA TOSHIO (JP)
YOSHIKAWA SHIGERU (JP)
MATSUMOTO TAKAAKI (JP)
YOSHIKAWA TAKAHIRO (JP)
SHINODA TAKASHI (JP)
TANAKA TAKAAKI (JP)
TAKIZAWA TOSHIO (JP)
YOSHIKAWA SHIGERU (JP)
MATSUMOTO TAKAAKI (JP)
YOSHIKAWA TAKAHIRO (JP)
SHINODA TAKASHI (JP)
Application Number:
PCT/JP2011/079873
Publication Date:
June 28, 2012
Filing Date:
December 22, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
OOTA MUNEHIRO (JP)
TANAKA TAKAAKI (JP)
TAKIZAWA TOSHIO (JP)
YOSHIKAWA SHIGERU (JP)
MATSUMOTO TAKAAKI (JP)
YOSHIKAWA TAKAHIRO (JP)
SHINODA TAKASHI (JP)
OOTA MUNEHIRO (JP)
TANAKA TAKAAKI (JP)
TAKIZAWA TOSHIO (JP)
YOSHIKAWA SHIGERU (JP)
MATSUMOTO TAKAAKI (JP)
YOSHIKAWA TAKAHIRO (JP)
SHINODA TAKASHI (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
| JP2010199595A | 2010-09-09 | |||
| JP2010161201A | 2010-07-22 | |||
| JP2009231795A | 2009-10-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: