Title:
POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/034618
Kind Code:
A1
Abstract:
The present invention provides a polishing liquid which contains: abrasive grains; an ether compound which has at least one group that is selected from the group consisting of a carboxy group and a carboxylate group; and water. The present invention also provides a polishing liquid set which is obtained by separating the constituents of the above-described polishing liquid into a first liquid and a second liquid for storage, so that the first liquid contains the abrasive grains and water, while the second liquid contains water and the ether compound which has at least one group that is selected from the group consisting of a carboxy group and a carboxylate group. The present invention also provides a polishing method which comprises a step for polishing a surface to be polished with use of the above-described polishing liquid, the surface to be polished containing silicon oxide.
Inventors:
FURUKAWA SATOSHI (JP)
MATSUMOTO TAKAAKI (JP)
MATSUMOTO TAKAAKI (JP)
Application Number:
PCT/JP2023/028988
Publication Date:
February 15, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Foreign References:
| JP2010073999A | 2010-04-02 | |||
| JP2017190395A | 2017-10-19 | |||
| JP2012501252A | 2012-01-19 | |||
| JP2023142077A | 2023-10-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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