Title:
POLISHING SLURRY COMPOSITION FOR SILICON CARBIDE WAFER
Document Type and Number:
WIPO Patent Application WO/2023/243905
Kind Code:
A1
Abstract:
The present invention relates to a polishing slurry composition for a silicon carbide wafer, and a polishing slurry composition for a silicon carbide wafer according to an embodiment of the present invention comprises polishing particles, an oxidant, a water-soluble transition metal, and a transition metal ion complexing agent.
Inventors:
CHOI BO HYEOK (KR)
KIM EUN OCK (KR)
SHIN NA RA (KR)
JUNG SUYEONG (KR)
KIM DONGWOOK (KR)
PAIK UNGYU (KR)
SONG TAESEUP (KR)
LEE GANGGYU (KR)
KIM EUN OCK (KR)
SHIN NA RA (KR)
JUNG SUYEONG (KR)
KIM DONGWOOK (KR)
PAIK UNGYU (KR)
SONG TAESEUP (KR)
LEE GANGGYU (KR)
Application Number:
PCT/KR2023/007368
Publication Date:
December 21, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
KCTECH CO LTD (KR)
IUCF HYU (KR)
IUCF HYU (KR)
International Classes:
C09G1/02; C09K3/14; H01L21/306
Domestic Patent References:
| WO2021200148A1 | 2021-10-07 |
Foreign References:
| US20100279506A1 | 2010-11-04 | |||
| JP2004327952A | 2004-11-18 | |||
| KR20030084633A | 2003-11-01 | |||
| KR20120037372A | 2012-04-19 | |||
| KR20220024518A | 2022-03-03 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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