Title:
POLISHING SLURRY COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/231115
Kind Code:
A1
Abstract:
The present invention relates to a polishing slurry composition and, to a polishing slurry composition comprising nanoceria abrasive particles and a water-soluble compound comprising an intramolecular hydrophilic group, and further selectively comprising at least one from among an amphoteric compound comprising an intramolecular carboxyl group and amine group, a surface modifier comprising an organic acid, and a pH adjuster.
Inventors:
KIM JUNG HUN (KR)
HWANG JUN HA (KR)
KWON O SEONG (KR)
HWANG JUN HA (KR)
KWON O SEONG (KR)
Application Number:
PCT/KR2022/003137
Publication Date:
November 03, 2022
Filing Date:
March 07, 2022
Export Citation:
Assignee:
KCTECH CO LTD (KR)
International Classes:
C09G1/02; C09K3/14
Foreign References:
| KR20200062796A | 2020-06-04 | |||
| KR20140059328A | 2014-05-16 | |||
| KR20200082046A | 2020-07-08 | |||
| JP2004331686A | 2004-11-25 | |||
| KR20150019008A | 2015-02-25 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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