POLYAMIDE ACID, POLYAMIDE ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, LAMINATE, METHOD FOR PRODUCING LAMINATE, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/157790

A1

A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic dianhydride residue includes a 3,3',4,4'-biphenyltetracarboxylic dianhydride residue and a spiro[11H-difuro[3,4-b:3',4'-i]xanthene-11,9'-[9H]fluorene]-1,3,7,9-tetrone residue. The diamine residue comprises a 2,2'-bis(trifluoromethyl)benzidine residue. The content of the 3,3',4,4'-biphenyltetracarboxylic dianhydride residue is more than 50 mol% with respect to the total amount of tetracarboxylic dianhydride residue. The content of the spiro[11H-difuro[3,4-b:3',4'-i]xanthene-11,9'-[9H]fluorene]-1,3,7,9-tetrone residue is greater than or equal to 1 mol% and less than 50 mol% with respect to the total amount of the tetracarboxylic dianhydride residue.

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JP2023034352	POLYAMIC ACID COMPOSITION AND METHOD FOR PRODUCING THE SAME
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NAKAYAMA HIROFUMI (JP)
SHIRAI YUKI (JP)

PCT/JP2023/004720

August 24, 2023

February 13, 2023

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KANEKA CORP (JP)

C08G73/10; B32B27/34; C08J5/18; H05K1/03

WO2021261177A1	2021-12-30
WO2019026806A1	2019-02-07

JP2021521284A

2021-08-26

HARUKA PATENT & TRADEMARK ATTORNEYS (JP)

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