POLYAMIDE ACID, POLYIMIDE, NON-THERMOPLASTIC POLYIMIDE FILM, MULTILAYER POLYIMIDE FILM, AND METAL-CLAD LAMINATE

WIPO Patent Application WO/2023/157789

A1

A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic acid dianhydride residue contains a 3, 3', 4, 4'-biphenyl tetracarboxylic acid dianydride residue and a 4, 4'-oxydiphtalic acid anydride residue. The diamine residue contains a p-phenylenediamine residue and a 1, 3-bis(4-aminophenoxy)benzene residue. The multilayer polyimide film (10) has a non-thermoplastic polyimide film (11) and an adhesive layer (12) which is disposed on at least one face of the non-thermoplastic polyimide film (11) and which includes a thermoplastic polyimide.

JP4620946	Method for producing polyimide precursor, method for producing polyimide precursor organic solvent solution, method for producing polyimide film, polyimide precursor, method for producing polyimide
JPH06816	The complex for structures as for which a screw * マレイミド resin system reaches and which is manufactured

SATO TAKAHIRO (JP)
OGUMA KEISUKE (JP)

PCT/JP2023/004719

August 24, 2023

February 13, 2023

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KANEKA CORP (JP)

C08G73/10; B32B15/088; B32B27/34; C08J5/18; H05K1/03

WO2016159060A1	2016-10-06
WO2008004496A1	2008-01-10
WO2022085619A1	2022-04-28

CN109503836A	2019-03-22
JP2017165909A	2017-09-21
JP2013018909A	2013-01-31

HARUKA PATENT & TRADEMARK ATTORNEYS (JP)

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