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Title:
POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/241471
Kind Code:
A1
Abstract:
The present invention provides: a polyamide resin which has a high melting point and a high glass transition temperature; a polyamide resin composition; and a molded article. A polyamide resin which is composed of a constituent unit derived from a diamine and a constituent unit derived from a dicarboxylic acid, wherein: 50% by mole or more of the constituent unit derived from a diamine is a constituent unit derived from p-benzenediethanamine; and 65% by mole or more of the constituent unit derived from a dicarboxylic acid is a constituent unit derived from an aromatic dicarboxylic acid.

Inventors:
OTSUKA KOSUKE (JP)
OKAJIMA YUYA (JP)
Application Number:
PCT/JP2021/019513
Publication Date:
December 02, 2021
Filing Date:
May 24, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G69/26
Domestic Patent References:
WO2017126409A12017-07-27
WO2018101163A12018-06-07
WO2010143638A12010-12-16
WO2012098840A12012-07-26
Foreign References:
CN106279905A2017-01-04
JPH02503541A1990-10-25
JPS4419268B11969-08-21
JPS6254725A1987-03-10
JPH083312A1996-01-09
JP2013513681A2013-04-22
JP2019532168A2019-11-07
JP2013538927A2013-10-17
JP2014525506A2014-09-29
JP6466632B12019-02-06
JP2016074804A2016-05-12
JP2021038370A2021-03-11
JP2012179911A2012-09-20
JP2020033539A2020-03-05
JP2021031633A2021-03-01
JP2018095706A2018-06-21
Other References:
See also references of EP 4159788A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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