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Title:
POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/196711
Kind Code:
A1
Abstract:
Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130°C) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a component unit (a) deriving from an aromatic dicarboxylic acid or alicyclic dicarboxylic acid and a component unit (b2) deriving from 1,3-bis(aminomethyl)cyclohexane. The polyamide resin composition further comprises at least one flame retardant (X) selected from the group consisting of polybrominated styrenes, brominated polystyrenes, and brominated polyphenylenes, or a flame retardant (Y) comprising a prescribed phosphinate salt compound or bisphosphinate salt compound or a polymer thereof.

Inventors:
DOI HARUKA
MAKIGUCHI WATARU
NISHINO KOHEI
WASHIO ISAO
Application Number:
PCT/JP2022/011769
Publication Date:
September 22, 2022
Filing Date:
March 16, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B29C45/00; C08G69/26; C08J5/00; C08K3/11; C08K5/5313; C08L25/06; C08L77/06; H01B3/30
Domestic Patent References:
WO2020040282A12020-02-27
WO2021224350A12021-11-11
WO2021224431A12021-11-11
WO2003085029A12003-10-16
Foreign References:
JP2020511578A2020-04-16
JP2019520464A2019-07-18
JP2010285553A2010-12-24
JP2017075303A2017-04-20
JP2014122329A2014-07-03
JP2016526597A2016-09-05
JPS5163859A1976-06-02
JP2016112890A2016-06-23
JP2003176408A2003-06-24
JPS4955796A1974-05-30
JP2017075303A2017-04-20
JP2021042349A2021-03-18
JP2021042360A2021-03-18
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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