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Patent Searching and Data


Title:
WAFER CONVEYANCE ROBOT AND WAFER EXTRACTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/196712
Kind Code:
A1
Abstract:
A robot (10) comprises an arm (13), a hand (14), a camera (15), a calculation unit, and an action control unit. The hand (14) is mounted to the arm (13) and supports and conveys a wafer (21). The camera (15) is mounted to the hand (14) and obtains images of the wafer (21) by photographing, from multiple viewpoints, the wafer (21) placed at an extraction position. The calculation unit calculates three-dimensional information of the wafer (21) on the basis of the hand (14) obtained by the camera (15). On the basis of the three-dimensional information of the wafer (21) calculated by the calculation unit, the action control unit causes the hand (14) to operate to extract the wafer (21).

Inventors:
HASHIZAKI SATOSHI
KITANO SHINYA
Application Number:
PCT/JP2022/011773
Publication Date:
September 22, 2022
Filing Date:
March 16, 2022
Export Citation:
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Assignee:
KAWASAKI HEAVY IND LTD (JP)
International Classes:
B25J9/06; B25J13/08; G01B11/00; H01L21/67; H01L21/677
Domestic Patent References:
WO2020045280A12020-03-05
WO2021039775A12021-03-04
WO2020261698A12020-12-30
WO2020116510A12020-06-11
WO2020045277A12020-03-05
WO2018062156A12018-04-05
WO2018062153A12018-04-05
WO2018061957A12018-04-05
Foreign References:
JP2010117223A2010-05-27
JP2005064515A2005-03-10
Attorney, Agent or Firm:
KATSURAGAWA, Naoki (JP)
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