Title:
POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/136205
Kind Code:
A1
Abstract:
This polyamide resin composition includes a polyamide resin and a copper-based heat-resistant stabilizing agent. The copper content in the copper-based stabilizing agent is 0.001-0.050 parts by mass with respect to 100 parts by mass of the polyamide resin. The polyamide resin includes a dicarboxylic acid-derived component unit (a) and a diamine-derived component unit (b). The dicarboxylic acid-derived component unit (a) includes an aromatic dicarboxylic acid-derived component unit or an alicyclic dicarboxylic acid-derived component unit. The diamine-derived component unit (b) includes a diamine-derived component unit (b2) represented by formula (1) in an amount of 10 mol% or more but less than 50 mol% with respect to the total number of moles of the diamine-derived component unit (b).
Inventors:
UEDA KOSUKE
MAKIGUCHI WATARU
DOI HARUKA
NISHINO KOHEI
WASHIO ISAO
KONDO TAKAHIRO
MAKIGUCHI WATARU
DOI HARUKA
NISHINO KOHEI
WASHIO ISAO
KONDO TAKAHIRO
Application Number:
PCT/JP2023/000141
Publication Date:
July 20, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08L77/06; C08G69/26; C08K3/105; C08K5/098
Domestic Patent References:
| WO2016001949A1 | 2016-01-07 | |||
| WO2022014390A1 | 2022-01-20 |
Foreign References:
| JPS4860193A | 1973-08-23 | |||
| JPS53125497A | 1978-11-01 | |||
| JPS63154739A | 1988-06-28 | |||
| JPH0632979A | 1994-02-08 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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