Title:
SUBSTRATE PARTICLES, CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/136204
Kind Code:
A1
Abstract:
Provided are substrate particles with which the connection resistance of an obtainable connection structure can be reduced and the conduction reliability can be enhanced even when mounted at low pressure. Substrate particles according to the present invention comprise polyorganosiloxane, wherein: the ratio of the number of silicon atoms having a two-bridge structure in the polyorganosiloxane to the number of silicon atoms having a three-bridge structure is 0.3 to 1.5; and the substrate particles have a compressive elastic modulus of 10,000 N/mm2 to 30,000 N/mm2 when the substrate particles are 10% compressed at 20 °C.
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Inventors:
ABE HIROTAKA (JP)
SUGIMOTO SATORU (JP)
HISANAGA SATOSHI (JP)
SUGIMOTO SATORU (JP)
HISANAGA SATOSHI (JP)
Application Number:
PCT/JP2023/000138
Publication Date:
July 20, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08J3/12; C08G77/20; C08G77/38; H01B1/20; H01B5/00; H01R11/01
Domestic Patent References:
| WO2018164067A1 | 2018-09-13 | |||
| WO2012020799A1 | 2012-02-16 |
Foreign References:
| JP2000273187A | 2000-10-03 | |||
| JP2015044988A | 2015-03-12 | |||
| JP2014159549A | 2014-09-04 | |||
| JP2004047343A | 2004-02-12 | |||
| JP2004035293A | 2004-02-05 | |||
| JPH07140472A | 1995-06-02 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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