Title:
POLYAMIDE RESIN COMPOSITION, MOLDED ARTICLE OBTAINED BY MOLDING SAME, AND METHODS FOR PRODUCING THOSE
Document Type and Number:
WIPO Patent Application WO/2023/140043
Kind Code:
A1
Abstract:
The present invention pertains to: a polyamide resin composition obtained by blending, with respect to 100 parts by weight of a polyamide resin (A), 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of isocyanate groups, epoxy groups, and acid anhydride groups; a molded article of said composition; and methods for producing the composition and the molded article. Provided is a polyamide resin composition which, even when the polyamide resin composition contains a silicone resin as an impurity, can suppress detachment of the silicone resin from a molded article obtained through injection molding of said polyamide resin composition and can suppress adhesion of the silicone resin to the surface of a mold during molding, and from which a molded article having excellent mechanical properties can be obtained.
Inventors:
AKITA MASARU (JP)
MORIYAMA MASAYUKI (JP)
FURUKAWA YUKI (JP)
MORIYAMA MASAYUKI (JP)
FURUKAWA YUKI (JP)
Application Number:
PCT/JP2022/047454
Publication Date:
July 27, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L77/00; C08J11/00; C08K5/09; C08K5/54; C08L83/04
Domestic Patent References:
| WO2012035673A1 | 2012-03-22 |
Foreign References:
| CN112322031A | 2021-02-05 | |||
| JP2018197316A | 2018-12-13 | |||
| JP2000327911A | 2000-11-28 |
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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