Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/140042
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is configured so as to suppress the occurrence of a dielectric breakdown in the semiconductor device. This semiconductor device is provided with: an insulating element; a conductive member on which the insulating element is mounted; and a sealing resin which covers the insulating element. The conductive member is provided with an uneven part that is covered by the sealing resin. With respect to one example of this semiconductor device, the conductive member comprises a first die pad on which the insulating element is mounted; and the uneven part comprises a first region that is arranged on the first die pad.
Inventors:
OSUMI YOSHIZO (JP)
NISHIOKA TARO (JP)
NISHIOKA TARO (JP)
Application Number:
PCT/JP2022/047430
Publication Date:
July 27, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020012957A1 | 2020-01-16 |
Foreign References:
| JP2005159137A | 2005-06-16 | |||
| JP2010161098A | 2010-07-22 | |||
| JPH0855866A | 1996-02-27 | |||
| US20060097366A1 | 2006-05-11 | |||
| JPH0992778A | 1997-04-04 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF: