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Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032780
Kind Code:
A1
Abstract:
Provided is a polyamide resin composition having satisfactory mechanical properties including tensile properties, flexural properties and impact resistance and having a low water absorption rate.　The polyamide resin composition according to the present invention comprises 55 to 78% by mass of an aliphatic polyamide resin (A), 20 to 35% by mass of glass fibers (B), 1 to 9% by mass of a crosslinking agent (C), 0.1 to 1.5% by mass of a heat-resisting agent (D), and 0 to 6% by mass of an inorganic filler (E) that is different from glass fibers in 100% by mass of the polyamide resin composition, in which the aliphatic polyamide resin (A) has an average number of carbon atoms of more than 6 per one amide group.

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Inventors:
YASUI TETSUYA (JP)
TONARI MASAYA (JP)
ARAKAWA SEIICHI (JP)
Application Number:
PCT/JP2022/031845
Publication Date:
March 09, 2023
Filing Date:
August 24, 2022
Export Citation:
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Assignee:
UBE CORP (JP)
International Classes:
C08L77/06; C08K5/3477; C08K7/14
Domestic Patent References:
WO2010084845A12010-07-29
WO2003037968A12003-05-08
WO2019054109A12019-03-21
Foreign References:
JP2016199665A2016-12-01
JPS4642027B1
JPH05247876A1993-09-24
JPH08291251A1996-11-05
JP2020125439A2020-08-20
JPH10338808A1998-12-22
JPS5227594A1977-03-01
JPS564651A1981-01-19
JP2011500952A2011-01-06
JP2016211598A2016-12-15
JPH0333134A1991-02-13
JP2015209512A2015-11-24
JP6283453B12018-02-21
JP2003327634A2003-11-19
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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