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Patent Searching and Data


Title:
POLYAMIDE RESIN, MOLDED BODY, LAMINATE, MEDICAL DEVICE, AND POLYAMIDE RESIN PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/088496
Kind Code:
A1
Abstract:
A polyamide resin with excellent balance of mechanical characteristics such as breaking strength and breaking elongation in a solid state, a molded body containing said polyamide resin, a laminate provided with a film or sheet containing said polyamide resin, a medical device provided with the aforementioned molded body and or the aforementioned laminate, and a production method of the aforementioned polyamide resin are provided. A polyamide resin is used which contains: a linear aliphatic dicarbonyl unit as unit (a); a linear aliphatic diamino unit as unit (b); at least one of unit (b) and unit (c), each of a prescribed structure; and a trivalent unit (e).

Inventors:
KATO TAKAYUKI (JP)
Application Number:
PCT/JP2017/040478
Publication Date:
May 17, 2018
Filing Date:
November 09, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08G69/40
Domestic Patent References:
WO2009139087A12009-11-19
WO2016047707A12016-03-31
WO2015155489A12015-10-15
Foreign References:
US5399663A1995-03-21
Attorney, Agent or Firm:
NIIYAMA Yuichi (JP)
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