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Patent Searching and Data


Title:
POLYAMIDE RESIN, MOLDED BODY, LAMINATE, MEDICAL DEVICE, AND POLYAMIDE RESIN PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/088497
Kind Code:
A1
Abstract:
A polyamide resin with excellent balance of mechanical characteristics such as breaking strength and breaking elongation in a solid state, a molded body containing said polyamide resin, a laminate provided with a film or sheet containing said polyamide resin, a medical device provided with the aforementioned molded body and or the aforementioned laminate, and a production method of the aforementioned polyamide resin are provided. The polyamide resin contains units derived from an aliphatic aminocarboxylic acid and corresponding to a hard segment, dicarbonyl units derived from a linear aliphatic dicarboxylic acid, and aliphatic diamino units each having a prescribed structure and containing an ether bond.

Inventors:
KATO TAKAYUKI (JP)
Application Number:
PCT/JP2017/040479
Publication Date:
May 17, 2018
Filing Date:
November 09, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08G69/36; A61L29/06; C08G69/40
Foreign References:
JPH09118750A1997-05-06
JPH04227633A1992-08-17
JP2001019763A2001-01-23
JP2011207935A2011-10-20
Attorney, Agent or Firm:
NIIYAMA Yuichi (JP)
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