Title:
POLYIMIDE-BASED RESIN FILM, SUBSTRATE FOR DISPLAY DEVICE USING SAME, AND OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120862
Kind Code:
A1
Abstract:
The present invention relates to a polyimide-based resin film, a substrate that is for a display device and uses the resin film, and an optical device, wherein the polyimide-based resin film has a thermal hysteresis gap of 100 μm to 500 μm at temperatures of 50°C to 150°C.
Inventors:
HONG YE JI (KR)
KANG MI EUN (KR)
KANG MI EUN (KR)
Application Number:
PCT/KR2022/012501
Publication Date:
June 29, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08J5/18; C08G73/10; C08K5/521; C08L79/08
Foreign References:
| KR20200084481A | 2020-07-13 | |||
| KR20210151323A | 2021-12-14 | |||
| CN109401313A | 2019-03-01 | |||
| KR20160003606A | 2016-01-11 | |||
| KR20150060551A | 2015-06-03 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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