Title:
POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2018/186215
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a colorless transparent polyimide film which has a heat resistance, a transparency, and a strength as good as conventional polyimide films, can be produced at lower cost than in the past, and has a higher resistance to methylethylketone than conventional colorless transparent polyimide films. The colorless transparent polyimide film according to the present invention is composed of a specific polyimide resin. The specific polyimide resin is composed of: a BPDA-derived site; at least one site selected from the group consisting of a BPADA-derived site and an ODPA-derived site; a TFMB-derived site; and at least one site selected from the group consisting of 3,3'-DDS-derived site and 4-4'-DDS-derived site. In addition, the haze value of this polyimide film is in a range of 0.1-2.0.
Inventors:
SHIRAI YUKI (JP)
MORIUCHI KOJI (JP)
MORIUCHI KOJI (JP)
Application Number:
PCT/JP2018/012023
Publication Date:
October 11, 2018
Filing Date:
March 26, 2018
Export Citation:
Assignee:
IST CORP (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2017073782A1 | 2017-05-04 | |||
WO2014148441A1 | 2014-09-25 | |||
WO2017051827A1 | 2017-03-30 |
Foreign References:
JP2012041473A | 2012-03-01 | |||
JP2016000462A | 2016-01-07 | |||
KR20150046463A | 2015-04-30 | |||
JPS627733A | 1987-01-14 | |||
JP2000313804A | 2000-11-14 | |||
JP2012040836A | 2012-03-01 | |||
KR20150046463A | 2015-04-30 |
Other References:
See also references of EP 3608350A4
Attorney, Agent or Firm:
KITAHARA Hiroyoshi et al. (JP)
Download PDF:
Previous Patent: CUP STRUCTURE MANUFACTURING METHOD
Next Patent: INNER CONDUCTOR TERMINAL AND SHIELD CONNECTOR
Next Patent: INNER CONDUCTOR TERMINAL AND SHIELD CONNECTOR