POLYIMIDE PRECURSOR COMPOSITION COMPRISING AROMATIC CARBOXYLIC ACID AND POLYIMIDE FILM MANUFACTURED USING SAME

Title:

POLYIMIDE PRECURSOR COMPOSITION COMPRISING AROMATIC CARBOXYLIC ACID AND POLYIMIDE FILM MANUFACTURED USING SAME

Document Type and Number:

WIPO Patent Application WO/2020/022564

Kind Code:

A1

Abstract:

The present invention provides a polyimide precursor composition comprising: a polyamic acid solution prepared by polymerization of at least one dianhydride monomer and at least one diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; a silicone-based additive; and an antioxidant, wherein the polyimide film manufactured of the polyimide precursor composition has an adhesion of 0.3 N/cm or more to a support and has a modulus of 8 GPa or more.

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Inventors:

HWANG IN HWAN (KR)

Application Number:

PCT/KR2018/013803

Publication Date:

January 30, 2020

Filing Date:

November 13, 2018

Export Citation:

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Assignee:

SKCKOLONPI INC (KR)

International Classes:

C08L79/08; C08J5/18; C08K5/092; C08K5/5415

Foreign References:

KR20110079810A	2011-07-08
KR20160125377A	2016-10-31
KR20070120553A	2007-12-24
KR20110101763A	2011-09-16
KR20160030889A	2016-03-21

Attorney, Agent or Firm:

LEE & KO IP (KR)

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