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Title:
POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/211086
Kind Code:
A1
Abstract:
Provided is a resin composition comprising: a poly(amic acid)/imide copolymer including a structural unit L represented by formula (1) and having a structure represented by general formula (A-1) as the X2 in general formula (1); an organic solvent; and at least one imidization catalyst selected from the group consisting of pyridine, triethylamine, 1,2-dimethylimidazole, 1-methylimidazole, 2-methylimidazole, 2-phenylimidazole, imidazole, benzimidazole, and N-tert-butoxycarbonylimidazole (N-Boc-imidazole). (In the formulae, X1 to X4, n, m, l, R1, R2, a, b, and * are as defined in the specification.)

Inventors:
KATO SATOSHI (JP)
SATO YUTA (JP)
KASHIWADA TAKESHI (JP)
KANADA TAKAYUKI (JP)
YORISUE TOMOHIRO (JP)
Application Number:
PCT/JP2022/016837
Publication Date:
October 06, 2022
Filing Date:
March 31, 2022
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08G73/10; C08G73/14; C08K5/3445; C08L79/08
Domestic Patent References:
WO2020148953A12020-07-23
WO2019106952A12019-06-06
WO2020138360A12020-07-02
Foreign References:
JP2018031018A2018-03-01
JP2017037136A2017-02-16
JP2012173453A2012-09-10
JP2010195856A2010-09-09
JP2021042381A2021-03-18
JP2014152221A2014-08-25
JP2010134116A2010-06-17
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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