Title:
POLYIMIDE, POLYIMIDE RESIN FILM, MULTILAYER BODY AND FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/106627
Kind Code:
A1
Abstract:
The present invention provides a polyimide which contains a specific structural unit, and which is characterized in that with respect to the IR spectrum of a resin film formed of this polyimide and having a thickness of 10 μm, if Y is the maximum peak intensity present within the range of from 1,450 to 1,550 cm-1 and Z is the maximum peak intensity present within the range of from 3,400 to 3,700 cm-1, Y and Z satisfy formula 0.1 ≤ Z/Y ≤ 0.4; and this polyimide has good transparency, oxidation resistance and laser releasability from a supporting substrate, while having low in-plane/out-of-plane birefringence, and enables the achievement of a polyimide resin film having excellent flexibility and a flexible device.
Inventors:
SAEKI AKINORI (JP)
MITSUI HIROKO (JP)
MITSUI HIROKO (JP)
Application Number:
PCT/JP2020/042409
Publication Date:
June 03, 2021
Filing Date:
November 13, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/34; C08G73/10
Domestic Patent References:
| WO2018084067A1 | 2018-05-11 |
Foreign References:
| CN102604385A | 2012-07-25 | |||
| JP2015229691A | 2015-12-21 | |||
| JP2019094499A | 2019-06-20 | |||
| JPH05222194A | 1993-08-31 | |||
| JP2020003787A | 2020-01-09 | |||
| JP2011183370A | 2011-09-22 | |||
| JP2018131601A | 2018-08-23 |
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