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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2019/211972
Kind Code:
A1
Abstract:
This polyimide resin has constituent unit A derived from a tetracarboxylic acid dianhydride and constituent unit B derived from a diamine, wherein constituent unit A includes a constituent unit (A-1) derived from a compound represented by formula (a-1), and constituent unit B includes a constituent unit (B-1) derived from a compound represented by formula (b-1) and a constituent unit (B-2) derived from a compound represented by formula (b-2). This polyimide varnish and this polyimide film contains the polyimide resin.

Inventors:
ABIKO YOHEI (JP)
SEKIGUCHI SHINJI (JP)
SUENAGA SHUYA (JP)
HARIU TOMOHIRO (JP)
Application Number:
PCT/JP2019/016036
Publication Date:
November 07, 2019
Filing Date:
April 12, 2019
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L79/08; C08G73/10
Domestic Patent References:
WO2011065131A12011-06-03
WO2018042999A12018-03-08
WO2017195574A12017-11-16
WO2017221776A12017-12-28
WO2018088543A12018-05-17
Foreign References:
JP2017071193A2017-04-13
JP2016222797A2016-12-28
Attorney, Agent or Firm:
HIRASAWA, Kenichi (JP)
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