Title:
POLYIMIDE RESIN
Document Type and Number:
WIPO Patent Application WO/2008/010494
Kind Code:
A1
Abstract:
Disclosed are: a polyimide resin which is soluble in an organic solvent and has a low water-absorption coefficient, excellent thermoplasticity, high heat resistance and excellent adhesion properties; a process for producing the polyimide resin; an adhesive agent comprising the polyimide resin; and a metal-clad laminate comprising a film and an adhesive layer comprising the polyimide resin. The polyimide resin has a repeating unit represented by the formula (1) and a repeating unit represented by the formula (2) and contains a group represented by the formula (3) in an amount of 50 mol% or more relative to the total amount of a group X.
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Inventors:
BITO TSUYOSHI (JP)
KIHARA SHUTA (JP)
OISHI JITSUO (JP)
KIHARA SHUTA (JP)
OISHI JITSUO (JP)
Application Number:
PCT/JP2007/064110
Publication Date:
January 24, 2008
Filing Date:
July 17, 2007
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
BITO TSUYOSHI (JP)
KIHARA SHUTA (JP)
OISHI JITSUO (JP)
BITO TSUYOSHI (JP)
KIHARA SHUTA (JP)
OISHI JITSUO (JP)
International Classes:
C08G73/10; B29C41/12; B32B15/088; C09J179/08; H05K1/03; B29K79/00; B29L7/00
Domestic Patent References:
| WO2006077964A2 | 2006-07-27 |
Foreign References:
| JP2007080885A | 2007-03-29 | |||
| JP2005015629A | 2005-01-20 | |||
| JP2005001380A | 2005-01-06 | |||
| JP2004358961A | 2004-12-24 | |||
| JP2007137050A | 2007-06-07 | |||
| JPH07166148A | 1995-06-27 | |||
| JP2000169579A | 2000-06-20 | |||
| JP2000319388A | 2000-11-21 | |||
| US3639343A | 1972-02-01 | |||
| JP2003155342A | 2003-05-27 | |||
| JP2003168800A | 2003-06-13 | |||
| JP2005015629A | 2005-01-20 | |||
| JPS5591895A | 1980-07-11 | |||
| JP2001329246A | 2001-11-27 |
Other References:
See also references of EP 2042540A4
Attorney, Agent or Firm:
OHTANI, Tamotsu (Bridgestone Toranomon Bldg. 6F.25-2, Toranomon 3-chom, Minato-ku Tokyo 01, JP)
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