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Patent Searching and Data


Title:
POLYMER AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2012/144798
Kind Code:
A2
Abstract:
The present invention relates to a polymer having a novel structure and photosensitive resin compositions containing the same. The photosensitive resin compositions containing the polymer according to the present invention are characterized with high taper angle and excellent adhesive strength. Thus, the photosensitive resin compositions containing the polymer according to the present invention can be applied to a variety of photosensitive materials, and especially applied preferably for manufacturing color filter patterns for LCD's.

Inventors:
KIM SUNHWA (KR)
JI HO CHAN (KR)
CHOI DONGCHANG (KR)
KIM HAN SOO (KR)
HEO YOON HEE (KR)
CHO CHANGHO (KR)
CHUNG WON JIN (KR)
Application Number:
PCT/KR2012/002955
Publication Date:
October 26, 2012
Filing Date:
April 18, 2012
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
KIM SUNHWA (KR)
JI HO CHAN (KR)
CHOI DONGCHANG (KR)
KIM HAN SOO (KR)
HEO YOON HEE (KR)
CHO CHANGHO (KR)
CHUNG WON JIN (KR)
International Classes:
C08F20/06; C08F20/10; C08F22/04; C08L33/04; G03F7/027
Foreign References:
US20100105793A12010-04-29
KR20100042173A2010-04-23
KR100918691B12009-09-22
US20080145783A12008-06-19
JP2006184574A2006-07-13
Attorney, Agent or Firm:
CHUNG, Soon-Sung (KR)
정순성 (KR)
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Claims: