Title:
POLYMER, POLYMER SOLUTION, PHOTOSENSITIVE RESIN COMPOSITION, AND CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/140257
Kind Code:
A1
Abstract:
A polymer including a structural unit represented by formula (NB), a structural unit represented by formula (AD), and at least one structural unit selected from among structural units represented by formula (1-2) and structural units represented by formula (1-3). In formula (NB), R1, R2, R3, and R4 are each independently a hydrogen atom or a C1-C30 organic group, a1 is 0, 1, or 2, and R13 and R14 are each independently a hydrogen atom or a C1-C3 alkyl group. In formula (AD), R11 and R12 are each independently a C1-C12, linear or branched alkyl group. In formula (1-2), Rp is a group having two or more (meth)acryloyl groups and R22 is a hydrogen atom or a C1-C3 organic group. In formula (1-3), Rs is a group having one (meth)acryloyl group and R22 is a hydrogen atom or a C1-C3 organic group.
Inventors:
TANABE JUNICHI (JP)
Application Number:
PCT/JP2023/001217
Publication Date:
July 27, 2023
Filing Date:
January 17, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08F232/08; C08F2/46; C08F222/06; C08F222/12; C08F222/26; C08F290/12; G02B5/20; G03F7/038
Domestic Patent References:
| WO2011129182A1 | 2011-10-20 |
Foreign References:
| JP2021196596A | 2021-12-27 | |||
| JPS6128513A | 1986-02-08 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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