Title:
MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/140256
Kind Code:
A1
Abstract:
Provided is a modified epoxy resin that is represented by formula (1) and includes a structural unit derived from an epoxy compound and a structural unit derived from an acid-terminated polyester, and in which the weight average molecular weight is 1,500-50,000 and the epoxy equivalent amount is 500-10,000 g/eq (in formula (1), n is a number between 1-30, X is a structural unit derived from an epoxy compound, and Y is a structural unit derived from a polyester).
Inventors:
SUGIYAMA DAIKI (JP)
Application Number:
PCT/JP2023/001214
Publication Date:
July 27, 2023
Filing Date:
January 17, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G59/14; C08G59/04; C08J5/24; C09D163/00; C09J163/00
Foreign References:
| JP2010282154A | 2010-12-16 | |||
| JP2002129126A | 2002-05-09 | |||
| JP2009286843A | 2009-12-10 | |||
| JP2001261777A | 2001-09-26 | |||
| KR101503284B1 | 2015-03-17 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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