Title:
POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVICE, BONDING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188500
Kind Code:
A1
Abstract:
The present invention is provided with: a positional relationship detection means for detecting the positional relationship between a target mark position registered by a pickup-side registration means and a target mark position registered by a bonding-side registration means; a pickup-side misalignment-amount detection means for detecting the amount of misalignment between a target mark position acquired as an image by a pickup-side image-acquisition means and the target mark position registered by the pickup-side registration means; and a position adjustment means for adjusting a bonding position on the basis of the amount of misalignment detected by the pickup-side misalignment-amount detection means, the amount of misalignment detected by a bonding-side misalignment-amount detection means, and the positional relationship detected by the positional relationship detection means.
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Inventors:
KAWAI SHINYA (JP)
KUBOTA YUSUKE (JP)
KUBOTA YUSUKE (JP)
Application Number:
PCT/JP2022/040438
Publication Date:
October 05, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
CANON MACHINERY INC (JP)
International Classes:
H05K13/04; H01L21/52; H05K13/08
Foreign References:
| US10861819B1 | 2020-12-08 | |||
| JP2016171107A | 2016-09-23 | |||
| JP2016197629A | 2016-11-24 | |||
| JP2016197630A | 2016-11-24 | |||
| JP2010041001A | 2010-02-18 | |||
| JP2005277273A | 2005-10-06 | |||
| JP2000079517A | 2000-03-21 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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