Title:
POSITION SPECIFICATION METHOD, POSITION SPECIFICATION PROGRAM, AND INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/180792
Kind Code:
A1
Abstract:
The present invention specifies the position of a mark formed on a semiconductor wafer from an image of the semiconductor wafer. A mark 201 includes at least a first pattern 501 and a second pattern 502. The first and second patterns have an identical shape of line symmetry with respect to a first axis and a second axis that are orthogonal to each other, and are arranged so as to be point symmetric. A position specification method according to the present disclosure includes: a first procedure of setting a partial image region 301 to an image 200; a second procedure of dividing the partial image region on the basis of a division index 401, and setting a part of a region of a first divided image as a reference image 402; a third procedure of determining whether a mark exists in the partial image region; and a fourth procedure of calculating, when it is determined in the third procedure that a mark exists in the partial image region, a representative position of the mark in the partial image region.
Inventors:
LI LIANG (JP)
MATSUMOTO KOSUKE (JP)
TAN WEI CHEAN (JP)
RYO KYO (JP)
YAMAMOTO JUNJI (JP)
MATSUMOTO KOSUKE (JP)
TAN WEI CHEAN (JP)
RYO KYO (JP)
YAMAMOTO JUNJI (JP)
Application Number:
PCT/JP2021/007371
Publication Date:
September 01, 2022
Filing Date:
February 26, 2021
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
H01L21/66
Foreign References:
| JPH10141920A | 1998-05-29 | |||
| JP2006190078A | 2006-07-20 | |||
| JP2011081485A | 2011-04-21 | |||
| JPH06187450A | 1994-07-08 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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