Title:
POSITIONING DEVICE AND WAFER CLAMPING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/045242
Kind Code:
A1
Abstract:
The application relates to a positioning device and a wafer clamping system. The positioning device is used in the wafer clamping system, and comprises a supporting mechanism and a positioning mechanism, wherein the positioning mechanism comprises a body portion and a limiting portion; the body portion is arranged on the supporting mechanism, and the limiting portion is connected to the body portion and protrudes relative to the body portion; the limiting portion and the body portion enclose an accommodating cavity, and at least part of a surface of the accommodating cavity is an arc-shaped surface; and the positioning device has a first state in which the body portion is movably connected to the supporting mechanism and can move relative to the supporting mechanism, and a second state in which the body portion and the supporting mechanism are locked. By means of the positioning device provided by the application, the mounting accuracy of the clamping mechanism for clamping a wafer can be improved, and the product yield can also be improved.
Inventors:
GAO JIA (CN)
LU FENG (CN)
YIN KAI (CN)
LU FENG (CN)
YIN KAI (CN)
Application Number:
PCT/CN2022/120671
Publication Date:
March 07, 2024
Filing Date:
September 22, 2022
Export Citation:
Assignee:
TAIWAN SEMICONDUCTOR MFG CO LTD (CN)
TSMC CHINA COMPANY LTD (CN)
TSMC CHINA COMPANY LTD (CN)
International Classes:
H01L21/677; H01L21/68; H01L21/687
Foreign References:
| CN1801472A | 2006-07-12 | |||
| CN105810620A | 2016-07-27 | |||
| CN113725143A | 2021-11-30 | |||
| CN102709222A | 2012-10-03 | |||
| US20080095600A1 | 2008-04-24 |
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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