Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/182327
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a positive photosensitive resin composition which has high sensitivity, good development adhesion and high heat resistance, while providing a cured product thereof with high folding resistance, and which enables the achievement of high reliability if a cured product thereof is used in an organic EL display device. The present invention provides a positive photosensitive resin composition which contains (A) one or more substances that are selected from the group consisting of a polyimide, a polyimide precursor and a copolymer of those, (B) one or more substances that are selected from the group consisting of a polybenzoxazole, a polybenzoxazole precursor and a copolymer of those, (C) a polyhydroxystyrene and/or a copolymer of a polyhydroxystyrene and a polystyrene, (D) a quinonediazide compound, and (E) a solvent, wherein: the content of the component (B) is 10 parts by mass to 100 parts by mass relative to 100 parts by mass of the component (A); and the content of the component (C) is 1 part by mass to 90 parts by mass relative to 100 parts by mass of the component (A).
Inventors:
FUKUHARA SHO (JP)
HARATA SAKI (JP)
SHUTO YUTA (JP)
FUKUSHIMA WATARU (JP)
MIYOSHI KAZUTO (JP)
HARATA SAKI (JP)
SHUTO YUTA (JP)
FUKUSHIMA WATARU (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2023/011133
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/023; G03F7/004; H05B33/10; H05B33/12; H05B33/26; H10K50/00
Domestic Patent References:
| WO2018159384A1 | 2018-09-07 |
Foreign References:
| JP2011158921A | 2011-08-18 | |||
| KR20130042212A | 2013-04-26 | |||
| KR20220130042A | 2022-09-26 |
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