Title:
POSITIVE RESIST COMPOSITION FOR CIRCUIT BOARD, AND POSITIVE DRY FILM FOR CIRCUIT BOARD, AND PROCESS FOR PRODUCING CIRCUIT BOARD WITH USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2007/069585
Kind Code:
A1
Abstract:
A positive resist composition for circuit board, and positive dry film for circuit board, characterized by containing a vinyl polymer having monomer units having an alkali-soluble group blocked with an alkyl vinyl ether. Further, there is provided a process for producing a circuit board with the use thereof.
Inventors:
IMAI GENJI (JP)
MURAYAMA TOSHIKAZU (JP)
HAGINO HARUFUMI (JP)
MURAYAMA TOSHIKAZU (JP)
HAGINO HARUFUMI (JP)
Application Number:
PCT/JP2006/324724
Publication Date:
June 21, 2007
Filing Date:
December 12, 2006
Export Citation:
Assignee:
KANSAI PAINT CO LTD (JP)
IMAI GENJI (JP)
MURAYAMA TOSHIKAZU (JP)
HAGINO HARUFUMI (JP)
IMAI GENJI (JP)
MURAYAMA TOSHIKAZU (JP)
HAGINO HARUFUMI (JP)
International Classes:
G03F7/039; G03F7/004; H01L21/027; H05K3/00
Domestic Patent References:
WO2004081065A1 | 2004-09-23 | |||
WO2003006407A1 | 2003-01-23 | |||
WO2006115117A1 | 2006-11-02 | |||
WO2006009258A1 | 2006-01-26 |
Foreign References:
JP2005091433A | 2005-04-07 | |||
JP2004053617A | 2004-02-19 | |||
JP2004054106A | 2004-02-19 | |||
JPH11286535A | 1999-10-19 | |||
JPH05506106A | 1993-09-02 | |||
JP2004045448A | 2004-02-12 | |||
JPH06308733A | 1994-11-04 | |||
JP2006003861A | 2006-01-05 | |||
JP2006178423A | 2006-07-06 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (16th Kowa Bldg. 9-20, Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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