Title:
POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/017267
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a power conversion device having high heat radiation performance. This power conversion device is provided with a power semiconductor module, and a flow path formation body for forming an opening and a flow path connected to the opening. The power semiconductor module is provided with a circuit body having a power semiconductor element, a first base section and second base section, and a frame connected to the first base section and the second base section. The first base section has a first fin and on a side near the opening a first sealing section for blocking a part of the opening. The second base section has a second fin and on a side near the opening a second sealing section for blocking a part of the opening. The frame is connected to a side of the first base section where the first sealing section is not formed, and is connected to a side of the second base section where the second sealing section is not formed. The opening is blocked by a part of the frame, the first sealing section, and the second sealing section.
Inventors:
SHIMAZU HIROMI (JP)
SASAKI KOUJI (JP)
TANIE HISASHI (JP)
TOKUYAMA TAKESHI (JP)
MATSUSHITA AKIRA (JP)
SHIMURA TAKAHIRO (JP)
SASAKI KOUJI (JP)
TANIE HISASHI (JP)
TOKUYAMA TAKESHI (JP)
MATSUSHITA AKIRA (JP)
SHIMURA TAKAHIRO (JP)
Application Number:
PCT/JP2015/065963
Publication Date:
February 04, 2016
Filing Date:
June 03, 2015
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H02M7/48
Foreign References:
| JP2011077464A | 2011-04-14 | |||
| JP2010119300A | 2010-05-27 | |||
| JP2010110143A | 2010-05-13 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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