Title:
POWER MODULE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/137704
Kind Code:
A1
Abstract:
This power module comprises a power semiconductor element joined to one surface of a conductor plate, a sheet member that includes an insulating layer joined to the other surface of the conductor plate, and a sealing member that seals the conductor plate and the sheet member using a transfer mold, wherein the conductor plate is divided into a first region in which the power semiconductor element is joined to the one surface, and a second region that is in contact with the seal member on the one surface, and a low-rigidity part, which has low rigidity, is formed in the second region.
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Inventors:
TSUYUNO NOBUTAKE (JP)
TAKAGI YUSUKE (JP)
SHIMAZU HIROMI (JP)
KANEKO YUJIRO (JP)
TAKAGI YUSUKE (JP)
SHIMAZU HIROMI (JP)
KANEKO YUJIRO (JP)
Application Number:
PCT/JP2021/036018
Publication Date:
June 30, 2022
Filing Date:
September 29, 2021
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L25/07; H01L23/28; H01L23/29; H01L23/31; H01L25/18
Foreign References:
| JP2014216459A | 2014-11-17 | |||
| JP2018014357A | 2018-01-25 | |||
| JP2013106503A | 2013-05-30 | |||
| JP2012244035A | 2012-12-10 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
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