Title:
POWER MODULE COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/224203
Kind Code:
A1
Abstract:
The present invention relates to a power module cooling device comprising: a housing part having an inlet part through which a refrigerant flows in and an outlet part through which the refrigerant flows out, and having a flow space formed therein such that the refrigerant can flow; a cover part of which one surface comes into direct or indirect contact with at least one heating element and the other surface is coupled to the housing part so as to seal the flow space; and a heat exchange part which is formed of a plurality of fins protruding from the other surface and is inserted into the flow space such that heat generated from the heating element is transferred to the refrigerant, wherein the heat exchange part may be formed at different heights on the basis of a vertical cross section in a direction in which the refrigerant flows, depending on a contact position where the heating element contacts the cover part or a heating position where heat is generated by the heating element.
Inventors:
LEE KEUN JAE (KR)
KIM TAE HEON (KR)
SUN JU HYUN (KR)
PARK KANG WOOK (KR)
JUN SANG HYUK (KR)
RYU KWAN HO (KR)
KIM TAE HEON (KR)
SUN JU HYUN (KR)
PARK KANG WOOK (KR)
JUN SANG HYUK (KR)
RYU KWAN HO (KR)
Application Number:
PCT/KR2022/020827
Publication Date:
November 23, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
DONG YANG PISTON CO LTD (KR)
International Classes:
H05K7/20
Foreign References:
| KR20210104450A | 2021-08-25 | |||
| KR20210045155A | 2021-04-26 | |||
| JP2013165097A | 2013-08-22 | |||
| JP2000092819A | 2000-03-31 | |||
| JP4738192B2 | 2011-08-03 |
Attorney, Agent or Firm:
LEE, In Haeng et al. (KR)
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