Title:
POWER MODULE COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/224204
Kind Code:
A1
Abstract:
The present invention relates to a power module cooling device comprising: a housing unit having an inlet into which a refrigerant flows and an outlet from which the refrigerant is discharged, and having a flow space therein so that the refrigerant can flow; a cover unit having one surface with which at least one heating element directly or indirectly comes into contact, and having the other surface coupled to the housing unit so that the flow space can be sealed; and a heat exchange unit having a plurality of pins protruding from the other surface of the cover unit so as to be inserted into the flow space, thereby enabling heat generated from the heating element to be transferred to the refrigerant, wherein the housing unit or the heat exchange unit can be formed such that the cross-sectional area of the flow space becomes smaller in the direction in which the refrigerant flows.
More Like This:
Inventors:
LEE KEUN JAE (KR)
KIM TAE HEON (KR)
SUN JU HYUN (KR)
PARK KANG WOOK (KR)
JUN SANG HYUK (KR)
RYU KWAN HO (KR)
KIM TAE HEON (KR)
SUN JU HYUN (KR)
PARK KANG WOOK (KR)
JUN SANG HYUK (KR)
RYU KWAN HO (KR)
Application Number:
PCT/KR2022/020829
Publication Date:
November 23, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
DONG YANG PISTON CO LTD (KR)
International Classes:
H05K7/20
Foreign References:
| KR20210104450A | 2021-08-25 | |||
| US20190195567A1 | 2019-06-27 | |||
| KR101432378B1 | 2014-08-20 | |||
| KR101182661B1 | 2012-09-17 | |||
| KR20130131603A | 2013-12-04 |
Attorney, Agent or Firm:
LEE, In Haeng et al. (KR)
Download PDF: