Title:
POWER SUPPLY SYSTEM AND SEMICONDUCTOR PACKAGE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/063827
Kind Code:
A1
Abstract:
An electronic device includes a plurality of semiconductor dies (A-D) stacked vertically over each other and a power supply system (402, 600). The semiconductor dies (A-D) are stacked over the power supply system (402, 600). The power supply system (402, 600) includes: a voltage generating circuit (610) configured to generate at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies (A-D) through a power interconnecting structure. A semiconductor package structure (400) includes a package substrate (401); at least one semiconductor die (A-D) disposed on the package substrate (401); and the aforementioned power supply system (402, 600) disposed on the package substrate (401). The at least one semiconductor die (A-D) may include a plurality of semiconductor dies (A-D) vertically stacked on the package substrate (401).
Inventors:
NING SHU-LIANG (CN)
Application Number:
PCT/CN2019/108429
Publication Date:
April 02, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C5/14
Foreign References:
| US20120250443A1 | 2012-10-04 | |||
| US20120250443A1 | 2012-10-04 | |||
| US20130070540A1 | 2013-03-21 | |||
| CN109147835A | 2019-01-04 | |||
| CN208767023U | 2019-04-19 | |||
| CN109147834A | 2019-01-04 | |||
| US20080024096A1 | 2008-01-31 | |||
| US20130329481A1 | 2013-12-12 | |||
| US20110121811A1 | 2011-05-26 |
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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