Title:
PREPARATION METHOD FOR PCB, AND PCB
Document Type and Number:
WIPO Patent Application WO/2023/178851
Kind Code:
A1
Abstract:
Disclosed in the present application is a preparation method for a PCB, and a PCB. The preparation method comprises: providing a PCB to be fabricated, the PCB to be fabricated being provided with a via hole that penetrates from the component side to the solder side; subjecting the component side and the solder side of the PCB to be fabricated to one-step etching to complete the fabrication of all outer-layer patterns; coating or attaching the opposite surfaces of a specific area of the PCB to be fabricated with a conductive material so as to form a conductive material layer, wherein the conductive material is a conductive fluid material or a conductive solid material containing an adhesive component; and subjecting the specific area to a gold plating treatment.
Inventors:
XU BIHUI (CN)
YANG HAIYUN (CN)
HE LUOSHENG (CN)
ZHANG HENG (CN)
YUAN JIWANG (CN)
YANG HAIYUN (CN)
HE LUOSHENG (CN)
ZHANG HENG (CN)
YUAN JIWANG (CN)
Application Number:
PCT/CN2022/099823
Publication Date:
September 28, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
SHENGYI ELECTRONICS CO LTD (CN)
International Classes:
H05K3/24
Foreign References:
| CN102014584A | 2011-04-13 | |||
| CN102014579A | 2011-04-13 | |||
| CN102014582A | 2011-04-13 | |||
| CN110678004A | 2020-01-10 | |||
| JP2005064012A | 2005-03-10 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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