Title:
PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING PREPREG, AND METHOD FOR MANUFACTURING METAL-CLAD LAMINATED PLATE
Document Type and Number:
WIPO Patent Application WO/2022/255278
Kind Code:
A1
Abstract:
Provided is a prepreg obtained by impregnating, with a thermosetting resin composition, a fiber matrix having a thickness of 40 μm or more, wherein the prepreg has an impregnated region and a non-impregnated region of the thermosetting resin composition in the fiber matrix, and has a surface waviness (Wa) of 5.0 μm or less. Also provided are: a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package, each of which is obtained using said prepreg; a method for manufacturing said prepreg; and a method for manufacturing said metal-clad laminated plate.
Inventors:
TONOUCHI SHUNSUKE (JP)
KITAJIMA TAKAYO (JP)
MAGOTA SEIYA (JP)
AOYAMA KAZUKI (JP)
SHIMAOKA SHINJI (JP)
TOSAKA YUJI (JP)
SAITOH TAKESHI (JP)
SASAKI RYOHTA (JP)
NAKANISHI KOTA (JP)
KITAJIMA TAKAYO (JP)
MAGOTA SEIYA (JP)
AOYAMA KAZUKI (JP)
SHIMAOKA SHINJI (JP)
TOSAKA YUJI (JP)
SAITOH TAKESHI (JP)
SASAKI RYOHTA (JP)
NAKANISHI KOTA (JP)
Application Number:
PCT/JP2022/021851
Publication Date:
December 08, 2022
Filing Date:
May 30, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B29B11/16; B32B5/02; B32B5/28; C08J5/24; H05K1/03; H05K3/46
Domestic Patent References:
| WO2017122820A1 | 2017-07-20 |
Foreign References:
| JP2013180406A | 2013-09-12 | |||
| JP2019199062A | 2019-11-21 | |||
| JP2007099966A | 2007-04-19 | |||
| JP2004106347A | 2004-04-08 | |||
| JP2019157009A | 2019-09-19 | |||
| JP2011132535A | 2011-07-07 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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