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Patent Searching and Data


Title:
PRESSURE-INDUCTION STRUCTURE AND ELECTRONIC PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/185003
Kind Code:
A1
Abstract:
Provided are a pressure-induction structure (100) and an electronic product. In the pressure-induction structure (100), a first elastic carrier (20) is provided on a first mounting surface (10a) of a substrate (10), and a semiconductor thin film (40) is provided on the elastic carrier. When the substrate (10) deforms, the elastic carrier bends and deforms following the substrate (10), the substrate (10) amplifies a strain signal, the semiconductor thin film (40) can detect the amount of bending deformation of the substrate (10), and a signal measurement circuit of the semiconductor thin film (40) outputs a discernible electrical signal. The pressure-induction structure (100) is a sensor structure that is small in size, with a high precision, high reliability and high sensitivity. The pressure-induction structure (100) is bonded to a panel (201) or a side frame of an electronic product, so as to prevent the defects of a discontinuous appearance, difficulty in being waterproof and dustproof, a short service life and difficult installation of an electronic product caused by the use of conventional mechanical keys.

Inventors:
HUANG TUOXIA (CN)
YU JINBO (CN)
Application Number:
PCT/CN2021/075915
Publication Date:
September 23, 2021
Filing Date:
February 08, 2021
Export Citation:
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Assignee:
SHENZHEN NEW DEGREE TECH CO LTD (CN)
International Classes:
G06F3/041; G01L1/22
Domestic Patent References:
WO2018133054A12018-07-26
WO2017133016A12017-08-10
WO2017133017A12017-08-10
Foreign References:
CN106301324A2017-01-04
CN204652340U2015-09-16
CN105224129A2016-01-06
CN106855756A2017-06-16
CN108037844A2018-05-15
EP0195232A21986-09-24
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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