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Title:
PRESSURE SENSING APPARATUS AND PRESSURE SENSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/185004
Kind Code:
A1
Abstract:
A pressure sensing apparatus (20) and a pressure sensing device. The pressure sensing apparatus (20) comprises one or more pressure sensing sheets (10) and a first substrate (22) bearing the pressure sensing sheets (10); each pressure sensing sheet (10) is connected to the first substrate (22) by means of welding; a welding spot of the welding is used for deformation transfer and electrical signal transmission; the pressure sensing sheet (10) comprises at least one semiconductor thin film (12); a signal measurement circuit is integrated in the semiconductor thin film (12) and is used for measuring a deformation amount of the deformation and outputting a recognizable electrical signal. The signal measurement circuit is integrated in the semiconductor thin film (12), so that the structural volume can be reduced, the integration level of a product is improved, and miniaturization of the product is facilitated.

Inventors:
HUANG TUOXIA (CN)
YU JINBO (CN)
Application Number:
PCT/CN2021/075916
Publication Date:
September 23, 2021
Filing Date:
February 08, 2021
Export Citation:
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Assignee:
SHENZHEN NEW DEGREE TECH CO LTD (CN)
International Classes:
H01L41/00; G06F3/041; H01L27/00
Domestic Patent References:
WO2019014866A12019-01-24
Foreign References:
CN101719482A2010-06-02
CN101526411A2009-09-09
JPH06302835A1994-10-28
CN109238525A2019-01-18
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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