Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/153636
Kind Code:
A1
Abstract:
The present invention relates to a pressure-sensitive adhesive composition including a base polymer, wherein the base polymer is a copolymer including structures derived from (a) a water-insoluble hydrophilic monomer and (b) a nitrogenous hydrophilic monomer and the base polymer has a content of structures derived from the water-insoluble hydrophilic monomer (a) of 40 mass% or higher.
Inventors:
TANI KENSUKE (JP)
TSUMURA DAISUKE (JP)
TSUMURA DAISUKE (JP)
Application Number:
PCT/JP2021/002920
Publication Date:
August 05, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/04; C09J7/38; C09J133/14; C09J133/24; C09J133/26; C09J201/00
Domestic Patent References:
| WO2014168178A1 | 2014-10-16 |
Foreign References:
| JP2013256552A | 2013-12-26 | |||
| JP5537789B2 | 2014-07-02 | |||
| JP2011127039A | 2011-06-30 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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