Title:
THREE-DIMENSIONAL MOLDING FILAMENT
Document Type and Number:
WIPO Patent Application WO/2021/153637
Kind Code:
A1
Abstract:
The present invention addresses the problem of obtaining a three-dimensional molding filament having a multilayer structure, with which all the properties of each layer can be expressed efficiently, and can coexist. A three-dimensional molding filament according to the present invention has a sea-island structure in a cross section perpendicular to the longitudinal direction, wherein the sea of the sea-island structure contains a thermoplastic resin (A), the islands of the sea-island structure contain a thermoplastic resin (B), and the sea-island structure is continuous in the longitudinal direction of the filament.
Inventors:
HIRANO AKIKO (JP)
Application Number:
PCT/JP2021/002921
Publication Date:
August 05, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B33Y80/00; B29C64/118; B29C64/259; B33Y70/00
Domestic Patent References:
| WO2019151235A1 | 2019-08-08 | |||
| WO2019235104A1 | 2019-12-12 |
Foreign References:
| JP2017177497A | 2017-10-05 | |||
| JP3222768U | 2019-08-22 | |||
| JP2020029091A | 2020-02-27 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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