Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/070899
Kind Code:
A1
Abstract:
Provided are: a pressure-sensitive adhesive composition which can form pressure-sensitive adhesive layers low in permittivity and dielectric loss in a high-frequency band and suitable for bonding members for constituting millimeter-wave antennas; and a pressure-sensitive adhesive sheet. A pressure-sensitive adhesive composition according to a first aspect of the present invention has a permittivity at 28-GHz frequency of 2-5 and a dielectric loss at 28-GHz frequency of 0.0001-0.05. A pressure-sensitive adhesive composition according to a second aspect of the present invention has a permittivity at 60-GHz frequency of 2-5 and a dielectric loss at 60-GHz frequency of 0.0001-0.05.
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Inventors:
KATAMI HIROFUMI (JP)
SASAHARA KAZUKI (JP)
NAKANO TAKESHI (JP)
NONAKA TAKAHIRO (JP)
TAKAHASHI TOMOKAZU (JP)
SASAHARA KAZUKI (JP)
NAKANO TAKESHI (JP)
NONAKA TAKAHIRO (JP)
TAKAHASHI TOMOKAZU (JP)
Application Number:
PCT/JP2021/033795
Publication Date:
April 07, 2022
Filing Date:
September 14, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/38; H01Q1/38; H01Q13/08
Domestic Patent References:
| WO2014147903A1 | 2014-09-25 | |||
| WO2020071390A1 | 2020-04-09 |
Foreign References:
| CN110982489A | 2020-04-10 | |||
| CN110708406A | 2020-01-17 | |||
| JP2018035226A | 2018-03-08 | |||
| JP2019218452A | 2019-12-26 | |||
| JP2013151638A | 2013-08-08 | |||
| JP2019186942A | 2019-10-24 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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