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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, MASKING TAPE, SURFACE PROTECTION METHOD, AND COPOLYMER DISPERSION LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/120049
Kind Code:
A1
Abstract:
[Problem] To provide a pressure-sensitive adhesive composition which exhibits sufficient peel strength as required for masking tape applications and which can yield a pressure-sensitive adhesive layer having excellent aqueous coating material resistance and solvent coating material resistance. [Solution] This pressure-sensitive adhesive composition contains a copolymer (A), a crosslinking agent (B) and an aqueous medium. The copolymer (A) contains: structural units derived from at least one type of monomer (a1) selected from the group consisting of an alkyl (meth)acrylate ester having only one ethylenically unsaturated bond and a hydrocarbon having only one ethylenically unsaturated bond; structural units derived from a monomer (a2) having an ethylenically unsaturated bond and a carboxyl group; and structure units derived from a monomer (a3) having an ethylenically unsaturated bond and a tertiary amino group. The crosslinking agent (B) contains a polyepoxy compound.

Inventors:
KUNANU KIRIDA (JP)
OKADO TAKASHI (JP)
Application Number:
PCT/JP2022/043777
Publication Date:
June 29, 2023
Filing Date:
November 28, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J133/14; C09J7/21; C09J7/38
Foreign References:
CN113646397A2021-11-12
JP2004217838A2004-08-05
KR20150137419A2015-12-09
JP2001335766A2001-12-04
JP2009215528A2009-09-24
JPH10226776A1998-08-25
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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