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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND BONDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2021/200054
Kind Code:
A1
Abstract:
The present invention relates to: a pressure-sensitive adhesive composition comprising a polymer, an ionic liquid, and an alignable material; and a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition.

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Inventors:
AKAMATSU KAORI (JP)
TAKASHIMA MIKA (JP)
SUZUKI TATSUYA (JP)
Application Number:
PCT/JP2021/010230
Publication Date:
October 07, 2021
Filing Date:
March 12, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/00; B32B7/025; B32B7/06; B32B15/08; B32B27/18; B32B27/30; C09J7/38; C09J9/02; C09J11/06; C09J133/00; C09J167/00; C09J175/04; C09J201/00
Domestic Patent References:
WO2020050169A12020-03-12
WO2018159784A12018-09-07
WO2017064918A12017-04-20
WO2007018239A12007-02-15
WO2013180196A12013-12-05
WO2013168712A12013-11-14
Foreign References:
JP2010037355A2010-02-18
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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